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Question About RV1106 Module Solder Pad Assembly

Posted: 2026-06-18 13:29
by Nicojohnson

Hello LuckFox Team,

I am currently developing a custom PCB using the RV1106 module and followed the reference footprint provided in your hardware design files.

Since the RV1106 module has components mounted on both sides, it doesn't lie completely flat against the supporting printed circuit board (PCB). Consequently, the solder terminals don't make contact with the board terminals.

Could you explain how the RV1106 module should be soldered onto a custom PCB? Are there any recommended mounting techniques, modifications to the PCB footprint, spacers, or stencils?

Attached is a photo of the existing spacing in the project.

Has anyone successfully integrated the RV1106 module into a custom PCB, and if so, could you share any recommendations or design guidelines?

Thank you for your support.

Best regards,
Nicolas


Re: Question About RV1106 Module Solder Pad Assembly

Posted: 2026-06-22 1:16
by Crocodile

Hello, on the page https://wiki.luckfox.com/Core1106/Pinout we provide the Core1106-Footprint package. When designing your circuit board, the bottom area corresponding to this footprint needs to be hollowed out,refer to the design approach used in the Luckfox Pico Pi.

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